Wall Microstructures of High Aspect Ratio Enabled by Near‐Field Electrospinning
نویسندگان
چکیده
Near‐field electrospinning (NFES) holds the potential to develop into a versatile additive nanomanufacturing platform. However, impact of variety processing variables remains unresolved.Herein, effect solvents used prepare suitable solutions for 3D microstructuring by is studied. straight walls stacked fibers are fabricated using layer‐by‐layer fiber deposition approach. The choice substrate material also explored. results show that high vapor pressure, and low dielectric constant solvent, as well conductivity facilitate improved stacking layers. Utilizing these conditions, polyethylene oxide fabricated, maximum aspect ratio 191.7 ± 52.6, while chromium/gold dichloromethane/methanol solvent achieved.
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ژورنال
عنوان ژورنال: Advanced Engineering Materials
سال: 2022
ISSN: ['1527-2648', '1438-1656']
DOI: https://doi.org/10.1002/adem.202101740